Below is the lab equipment that is currently available for use in the BNC. Please visit the BNC’s about page to learn more about using the equipment.
Mask Aligner (1)
OAI Model 204
Mask Aligner (2)
OAI Model 206
Laurel Spinners for chip
General Purpose
Glass substrates
General Purpose
2-inch to 6-inch diameter wafers.
General Purpose
VacuumSpin, bake, align, expose, post-bake, develop, and clean stations. Degassing Station
Vacuum Degassing stations
Silanization Vapor Deposition Station
Scales for Silicone (PDMS) formulations
Curing Stations with Hot Plates and Ovens
Both Solvent and Acid Chemical hoods
Wafer Saw for silicon or glass substrate cutting
NanoSurf Atomic Force Microscope
Optical Profilometer:
Keyence 3D laser profile measurement system with full analysis software.
Stylus Profilometer:
Dektak stylus profilometers
Zeiss Universal with Differential Interference Contrast Microscope
Leica Light and Dark Field Microscope
World Precision Macro Documentation Video Microscope
Nikon Inverted Microscope
FEI Quanta 3D FEG FIB with materials analysis EDX and EBSD, microindenter, OmniProbe, and STEM
FEI SCIOS 2 LoVac Dual Beam FIB with materials analysis EDX and EBSD, Nanomanipulator, Film Deposition
Zeiss Orion NanoFab
Physical Instruments 5600/5800 for small area elemental composition and chemical state analysis of materials surfaces; analysis of insulating samples using electron beam neutralization during analysis; depth profiling of surfaces and interfaces.
Vulcan 3-550 Furnaces
Neytech QEX Furnaces
Centurion Q50 Vacuum Oven
High Temperature Quartz Tube Furnace
High Temperature Presses for Hot Embossing
Thermal glass bonding station
Anodic bonding station
PETS RIE (Reactive Ion Etcher)
Modified NRC Thermal Evaporator
Modified CommonWealth Magnetron Sputtering Deposition System
Tergeo Plasma Etching, Cleaning, and Surface Modification System
