Below is the lab equipment that is currently available for use in the BNC. Please contact the managing director for specific availability information. Schedule equipment use here.
| Lithography: | |
| Mask Aligner (1) | OAI Model 204 |
| Mask Aligner (2) | OAI Model 206 |
| Thin/Thick Resist and Polymer Spinners: | |
| Laurel Spinners for chip | General Purpose |
| Glass substrates | General Purpose |
| 2-inch to 6-inch diameter wafers. | General Purpose |
| Full Lithography Processing Capabilities: | |
| VacuumSpin, bake, align, expose, post-bake, develop, and clean stations. Degassing Station | |
| Dry Film lamination Capabilities: | |
| Vacuum Degassing stations | |
| Silanization Vapor Deposition Station | |
| Scales for Silicone (PDMS) formulations | |
| Curing Stations with Hot Plates and Ovens | |
| Surface Modification Stations for Both Wet and Dry Surface Treatments: | |
| Both Solvent and Acid Chemical hoods | |
| Wafer Saw for silicon or glass substrate cutting | |
| Full Optical and Stylus Metrology for Topology and Profile Measurements: | |
| Optical Profilometer: | Keyence 3D laser profile measurement system with full analysis software. |
| Stylus Profilometer: | Dektak stylus profilometers |
| Optical Microscopy for Inspections and Analysis: | |
| Zeiss Universal with Differential Interference Contrast Microscope | |
| Leica Light and Dark Field Microscope | |
| World Precision Macro Documentation Video Microscope | |
| Nikon Inverted Microscope | |
| Electron Microscopy: | |
| FEI Quanta 3D FEG FIB with materials analysis EDX and EBSD, microindenter, OmniProbe, and STEM | |
| FEI SCIOS 2 LoVac Dual Beam FIB with materials analysis EDX and EBSD, Nanomanipulator, Film Deposition | |
| Helium Ion Microscopy: | |
| Zeiss Orion NanoFab | |
| X-Ray Photoemission Spectroscopy: | |
| Physical Instruments 5600/5800 for small area elemental composition and chemical state analysis of materials surfaces; analysis of insulating samples using electron beam neutralization during analysis; depth profiling of surfaces and interfaces. | |
| Baking, Annealing, and Sintering Furnaces and Ovens: | |
| Vulcan 3-550 Furnaces | |
| Neytech QEX Furnaces | |
| Centurion Q50 Vacuum Oven | |
| High Temperature Quartz Tube Furnace | |
| High Temperature Presses for Hot Embossing | |
| Thermal glass bonding station | |
| Anodic bonding station | |
| Thin Film Deposition and Etching: | |
| PETS RIE (Reactive Ion Etcher) | |
| Modified NRC Thermal Evaporator | |
| Modified CommonWealth Magnetron Sputtering Deposition System | |
| Tergeo Plasma Etching, Cleaning, and Surface Modification System | |
| Barrel Plasma etcher. | |
| Biological Instruments: | |
| Centrifuges | |
| Chemical and Biological Hoods | Nuaire |
| Incubators | (Permission for shared use required) |
| Specimen Storage Refrigerators | |
| Sterilizer | Mark II |
| Syringe Pumps | |
| Mettler Scales | |
| Lab Rotator | |
| Ultrasonic Bath | |
| Sutter Instrument Pipette Puller | |
| GenePix Array Scanner | |
| Prototype/Fixture Machine Shop: | |
| Band Saw | Grizzly Model G0621 |
| Drill Press | Delta/GMC/Craftsman |
| Grinder | Grizzly Model H8126 |
| Lathe | Grizzly Model G0602 |
| Mill/Drill | Grizzly Model G0463 |
| Sander/Grinder | Grizzly Model H6070 |
| Stocked Chemicals: | |
| Acids | Hydrofluoric, Nitric, Hydrochloric, Sulfuric, Perchloric, Chrome Etch, Gold Etch |
| Bases | Potassium Hydroxide, Sodium Hydroxide |
| Gases | O2, N2, Ar, SF6, CF4 |
| Non-acidic Oxidizer | Hydrogen Peroxide |
| PDMS | Sylgard 184 |
| Photoresist Support | Developers, Primers, Strippers |
| Solvents | Acetone, n-Propanol (Isopropyl) |
