Below is the lab equipment that is currently available for use in the BNC. Please contact the managing director for specific availability information. Schedule equipment use here.
Lithography: | |
Mask Aligner (1) | OAI Model 204 |
Mask Aligner (2) | OAI Model 206 |
Thin/Thick Resist and Polymer Spinners: | |
Laurel Spinners for chip | General Purpose |
Glass substrates | General Purpose |
2-inch to 6-inch diameter wafers. | General Purpose |
Full Lithography Processing Capabilities: | |
VacuumSpin, bake, align, expose, post-bake, develop, and clean stations. Degassing Station | |
Dry Film lamination Capabilities: | |
Vacuum Degassing stations | |
Silanization Vapor Deposition Station | |
Scales for Silicone (PDMS) formulations | |
Curing Stations with Hot Plates and Ovens | |
Surface Modification Stations for Both Wet and Dry Surface Treatments: | |
Both Solvent and Acid Chemical hoods | |
Wafer Saw for silicon or glass substrate cutting | |
Full Optical and Stylus Metrology for Topology and Profile Measurements: | |
Optical Profilometer: | Keyence 3D laser profile measurement system with full analysis software. |
Stylus Profilometer: | Dektak stylus profilometers |
Optical Microscopy for Inspections and Analysis: | |
Zeiss Universal with Differential Interference Contrast Microscope | |
Leica Light and Dark Field Microscope | |
World Precision Macro Documentation Video Microscope | |
Nikon Inverted Microscope | |
Electron Microscopy: | |
FEI Quanta 3D FEG FIB with materials analysis EDX and EBSD, microindenter, OmniProbe, and STEM | |
FEI SCIOS 2 LoVac Dual Beam FIB with materials analysis EDX and EBSD, Nanomanipulator, Film Deposition | |
Helium Ion Microscopy: | |
Zeiss Orion NanoFab | |
X-Ray Photoemission Spectroscopy: | |
Physical Instruments 5600/5800 for small area elemental composition and chemical state analysis of materials surfaces; analysis of insulating samples using electron beam neutralization during analysis; depth profiling of surfaces and interfaces. | |
Baking, Annealing, and Sintering Furnaces and Ovens: | |
Vulcan 3-550 Furnaces | |
Neytech QEX Furnaces | |
Centurion Q50 Vacuum Oven | |
High Temperature Quartz Tube Furnace | |
High Temperature Presses for Hot Embossing | |
Thermal glass bonding station | |
Anodic bonding station | |
Thin Film Deposition and Etching: | |
PETS RIE (Reactive Ion Etcher) | |
Modified NRC Thermal Evaporator | |
Modified CommonWealth Magnetron Sputtering Deposition System | |
Tergeo Plasma Etching, Cleaning, and Surface Modification System | |
Barrel Plasma etcher. | |
Biological Instruments: | |
Centrifuges | |
Chemical and Biological Hoods | Nuaire |
Incubators | (Permission for shared use required) |
Specimen Storage Refrigerators | |
Sterilizer | Mark II |
Syringe Pumps | |
Mettler Scales | |
Lab Rotator | |
Ultrasonic Bath | |
Sutter Instrument Pipette Puller | |
GenePix Array Scanner | |
Prototype/Fixture Machine Shop: | |
Band Saw | Grizzly Model G0621 |
Drill Press | Delta/GMC/Craftsman |
Grinder | Grizzly Model H8126 |
Lathe | Grizzly Model G0602 |
Mill/Drill | Grizzly Model G0463 |
Sander/Grinder | Grizzly Model H6070 |
Stocked Chemicals: | |
Acids | Hydrofluoric, Nitric, Hydrochloric, Sulfuric, Perchloric, Chrome Etch, Gold Etch |
Bases | Potassium Hydroxide, Sodium Hydroxide |
Gases | O2, N2, Ar, SF6, CF4 |
Non-acidic Oxidizer | Hydrogen Peroxide |
PDMS | Sylgard 184 |
Photoresist Support | Developers, Primers, Strippers |
Solvents | Acetone, n-Propanol (Isopropyl) |